On February 10, 2026, the “Armenia-U.S. Technology & Innovation Summit” was held, in conjunction with the official visit of the U.S. Vice President J.D. Vance, to Armenia. The summit was organized jointly by the two governmental delegations.

Dr. Yervant Zorian, Synopsys Armenia President, delivered an invited talk representing the semiconductor sector and led high level discussions with the senior delegates. The Summit brought together senior U.S. and Armenian leadership, along with global technology players, at a time when the two countries are entering a new phase of strategic cooperation driven by shifts in global supply chains and the rising importance of semiconductors, AI, and cybersecurity.

Dr. Zorian presented a range of recent successful outcomes based on cooperation between the two countries in the semiconductor sector, using the Synopsys Armenia model as the anchor of this ecosystem. Then, he addressed the ongoing challenges and opportunities, such as the need for easing the US export control regulations and for strengthening the talent pipeline.

Building on the August 8, 2025, MoU on Semiconductor and AI Cooperation, which was signed in the White House between the two heads of state, the discussions focused on translating the strategic alliance into practical steps, with the goal of establishing resilient semiconductor supply chain, widening industry-level engagements across advanced AI infrastructure, and engineering talent development.

The Summit served as an execution-oriented platform aimed at enabling the U.S. companies to scale in Armenia, addressing regulatory and infrastructure barriers, and launching concrete cooperation tracks between government and industry.

Synopsys Armenia is honored to support this important partnership and contribute to strengthening Armenia’s role in the global semiconductor and AI ecosystem and thankful to the Ministry of High-Tech Industry of the Republic of Armenia ՀՀ բարձր տեխնոլոգիական արդյունաբերության նախարարություն for hosting the summit.